Q3 2024 Market Insights
The Rebound Q3/2024 Market Insights has been published. Download it now and get up to date on commodity and market…
Rebound Electronics’ ability to secure scarce parts globally has helped thousands of customers across Asia to keep production lines running during what has been an unprecedented almost three years of shortages. Customers have never experienced a shortage of such longevity & with such a breadth of components affected. As a result, Customers have re-evaluated their supply base, their supply chains, and their strategic partnerships. Rebound Asia was ready, willing, and able to support them in these most challenging times.
Rebound Asia recognises that the key to continued success is to continue to add value & service to Customers. Consequently, Rebound has invested in a new Asia Regional Warehouse & Test & Quality Centre in Hong Kong. This new capability offers greater capacity, more advanced services & faster throughput, to meet customers’ ever-increasing service expectations of Supply Chain, Quality & Test. The Asia Regional Centre forms part of Rebounds Global Infrastructure Capability, which benefits from Scale, Expertise, Experience & Best Practice.
Alongside the investment in Infrastructure, Rebound has invested significantly in new & additional Customer facing staff in Thailand, Vietnam, Malaysia, Philippines, Taiwan, Japan, Singapore & China.
Grant Fairburn MD Asia & Group Board Member commented “These strategic investments are consistent with Rebound Philosophy of Customer Service Excellence via Local People leveraging Regional & Global Infrastructure, Expertise & Experience. Regardless of the market Asia represents an enormous growth opportunity and we will continue to invest to support our customers”.
The Rebound Q3/2024 Market Insights has been published. Download it now and get up to date on commodity and market…
Our new ROM (Rebound Obsolescence Management) Report for August Issue has now been published.
Our new ROM (Rebound Obsolescence Management) Report for July Issue has now been published.
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