ROM Report August 2024
Our new ROM (Rebound Obsolescence Management) Report for August Issue has now been published.
KUALA LUMPUR, JUNE 1, 2024 — The SEMICON Southeast Asia 2024 event, themed “Boosting Agility and Resiliency of the Global Electronics Supply Chain,” took place at MITEC in Kuala Lumpur, Malaysia, from May 28-30. This prestigious event attracted visionaries and experts who shared their insights on the latest industry developments, trends, and innovations. It provided a dynamic platform for discussions on sustainability, smart manufacturing, and workforce development.
Rebound Electronics actively participated, particularly in the Market Industry and Trends, and Sustainability Forums, to provide our clients with real-time market insights and trends.
The impressive surge in attendance at SEMICON SEA 2024, with over 500 companies showcasing their innovations across 1,000 booths, highlighted the growing global significance of Southeast Asia’s semiconductor sector. The region accounts for US$200 billion in chip exports, driven by expanding manufacturing capabilities, supportive government policies, and a strong pool of skilled workers.
Ajit Manocha, SEMI President and CEO, emphasized Southeast Asia’s crucial role in accelerating the semiconductor industry’s growth, particularly through innovations such as GenAI. The event introduced numerous new programs and forums, including the Regional Human Resource Forum, Tech IDOL Competition, and the Chiplet and Heterogeneous Integration Summit. Attendees engaged in discussions on market trends, sustainability, advanced product testing, and smart initiatives like Smart MedTech and Smart Mobility.
Collaboration with Invest Selangor, MATRADE, MITI, and MIDA was instrumental in the event’s success, solidifying SEMICON Southeast Asia as a cornerstone of the global semiconductor industry.
Stay tuned for upcoming blogs about Market Trends and Insights, and Sustainability Forum takeaways from SEMICON SEA 2024!
Senior Commercial Analyst
JENNY ORTILLA
Our new ROM (Rebound Obsolescence Management) Report for August Issue has now been published.
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