ComputInsights #12 – Weekly Computing Market Insights

Market Growth

Tariff Truce Sparks Semiconductor Stock Rally, But Uncertainty Remains

A temporary tariff rollback between the U.S. and China boosted semiconductor stocks, with Nvidia rising 4.1% and Intel 3.1%, as investors welcomed a 90-day reprieve in trade tensions. The broader chip market surged, but strategic concerns persist—AI chip bans remain, and sector-specific tariffs could still be imposed. While the rally reflects short-term optimism, lasting policy clarity is still elusive.

M&A and Investments

Vietnam’s CT Semiconductor Expands Nation’s First Locally Owned IC Backend Plant Amid Industry Surge

Vietnam’s CT Semiconductor has launched the second phase of its chip packaging and testing facility in Binh Duong Province, aiming to produce 100 million chips annually by 2027. As the first fully locally owned IC backend plant, it signals Vietnam’s deeper move into semiconductors, complementing major investments from Intel, Amkor, and Hana Micron. With nearly US$100 million invested in advanced packaging, AI, and 6G-enabling technologies, CT’s expansion aligns with government ambitions to grow Vietnam into a global semiconductor hub—targeting US$25 billion in industry revenue by 2030.

EU and Japan Deepen Semiconductor Collaboration to Bolster Supply Chain and R&D Resilience

The EU and Japan have pledged to expand semiconductor research collaboration and strengthen digital ties during the third Digital Partnership Council in Tokyo. The initiative includes joint efforts in semiconductor R&D, supply chain resilience, quantum computing, AI, and cybersecurity. Both parties will implement early warning systems and information exchange to mitigate geopolitical risks threatening tech growth. The agreement signals Japan’s semiconductor resurgence, highlighted by TSMC’s new Kumamoto fab and four additional plants from JASM and Rapidus set to open in 2025, restoring Japan’s role in the global chip race.

Company-Specific News

NEO Semiconductor Unveils 3D X-DRAM Breakthrough, Promises 10x Density Boost

NEO Semiconductor has introduced new 1T1C and 3T0C 3D X-DRAM architectures that promise to increase DRAM bit density by 10x while enhancing power efficiency and scalability. Built on a 3D NAND-like process and using IGZO-channel technology, the innovation targets AI and in-memory computing with faster speeds and reduced refresh needs. A proof-of-concept chip is expected in 2026.