ComputInsights #10 – Weekly Computing Market Insights

Market Growth

DRAM Spot Price Update (April 28, 2025)

As of April 28, 2025, DDR5 16G spot prices remained stable with no change, averaging $5.54. DDR4 modules across various specifications experienced slight price increases, ranging from 0.29% to 0.82%. Meanwhile, DDR3 4Gb prices stayed flat, showing no percentage change during the session.

M&A and Investments 

China Launches Mega-Merger to Fortify Chip Toolmakers and Semiconductor Industry

China is pushing a massive consolidation of its semiconductor equipment sector, aiming to merge over 200 domestic chip toolmakers into about 10 stronger, scalable companies to counter U.S. sanctions and accelerate tech self-sufficiency. Leading firms like Naura Technology are expanding aggressively through acquisitions, while others reposition globally to dodge export controls and secure supply chains. This bold restructuring targets not just efficiency, but the creation of resilient, world-class chip toolmakers to support China’s broader semiconductor ambitions.

Company Specific News

Huawei Unveils New AI Chip to Challenge Nvidia Amid Rising Tech Rivalry

Huawei Technologies is preparing to test its most advanced AI processor yet, aiming to replace some of Nvidia’s high-end chips. This development highlights the resilience of China’s semiconductor sector despite U.S. efforts to curb its progress by restricting access to critical chip-making tools. As the tech rivalry intensifies, Huawei’s move underscores China’s push for greater self-reliance in cutting-edge technology.

TSMC Unveils Detailed Roadmap, New Nodes, and 3D-IC Advances at North America Technology Symposium

At its North America Technology Symposium, TSMC revealed a comprehensive roadmap featuring new 3D-IC architectures, system-on-wafer technologies, and the next-generation A14 process node for 2028, offering significant performance and power efficiency gains. The foundry also introduced N4C RF for smartphones and updated its automotive and IoT platforms, while major EDA companies pledged support for TSMC’s future nodes. Meanwhile, the semiconductor industry faces workforce cuts, $1 trillion in investment challenges, and new sustainability efforts, as highlighted by reports from Intel, McKinsey, ASML, and Imec.

Intel Expands Automotive Strategy with New Chiplet Architecture and AI Vehicle SoC

Intel introduced a multi-process-node chiplet architecture and its second-generation AI-enhanced software-defined vehicle SoC, targeting next-generation automotive computing. The company also announced partnerships with ModelBest and Black Sesame to develop AI-powered cockpits, integrated ADAS solutions, and energy-efficient vehicle platforms. These moves reinforce Intel’s ambition to lead in the fast-evolving automotive and mobility technology sectors.