ComputInsights #18 – Weekly Computing Market Insights

Market Growth

Science Tokyo Unveils BBCube: A Breakthrough in 2.5D/3D Chip Packaging for High-Performance Computing

Researchers from the Institute of Science Tokyo have introduced BBCube, a revolutionary 2.5D/3D chip integration method that overcomes the limitations of traditional SiP packaging. By using advanced bonding techniques and a novel adhesive, DPAS300, the team enabled ultra-dense chip stacking with reduced power supply noise and energy use—cutting transmission energy by up to 95%. This innovation paves the way for more efficient, compact, and powerful computing architectures.

Global AI Server Shipments to Reach 1.81 Million in 2025 Amid Strong Demand for LLM

Global AI server shipments are projected to reach 1.81 million units in 2025, with over one million being high-end models featuring HBM — a 40% increase from 2024. Despite global trade tensions and AI investment concerns, demand remains strong due to the rapid advancement of large language models. North American cloud providers will account for 70% of high-end server procurement. The market is also seeing broader adoption beyond the top four U.S. CSPs.

M&A and Investments

Semiconductor Firm Sequans to Raise $384M for Strategic Bitcoin Treasury

IoT chipmaker Sequans Communications is set to raise $384 million through equity and convertible debt to build a Bitcoin treasury, partnering with Swan Bitcoin. This move aligns with a growing trend, as the number of companies holding Bitcoin on their balance sheets has doubled to 240, now collectively owning 4% of total BTC supply.

Company-Specific News

Wolfspeed to File for Bankruptcy Amid $6.5B Debt Restructuring and Chips Act Fallout

US semiconductor firm Wolfspeed is set to file for bankruptcy after striking a deal to cut its $6.5 billion debt by 70%, wiping out most shareholder equity. The move follows the collapse of a $750 million Chips Act subsidy under the Biden administration, halted after the Trump administration’s election. The company aims to emerge from bankruptcy by year-end, converting about $5 billion in unsecured debt into equity to secure its future in EV chip manufacturing.