Reducing BOM risk in electronics manufacturing
Bill of Materials (BOM) risk has become such a salient issue in electronics manufacturing due to a confluence of factors.
In late September 2025, Super Typhoon Ragasa swept across Southeast Asia, exposing once again how vulnerable global supply chains remain to natural disasters. The storm carried different names in different regions – Nando in the Philippines, Ragasa internationally, and locally translated in Taiwan, Hong Kong, and Vietnam – but it’s impact was universal. Striking the Philippines on 21 September, Taiwan on 23 September, and Hong Kong, Southern China, and Vietnam in the days that followed, Ragasa left a trail of disruption across some of the world’s most critical electronics hubs.
You can view the full Insights document here.
Bill of Materials (BOM) risk has become such a salient issue in electronics manufacturing due to a confluence of factors.
The Rebound Q2 2026 Market Insights Buyers Guide has been published. Download it now for detailed lead times and sourcing…
The Rebound Q2 2026 Market Insights has been published. Download it now for a complete view of the market.Â
The semiconductor memory market remains in an AI-driven upcycle, with tight supply and elevated pricing across DRAM and NAND.
The May issue of Rebound Monthly Market Insights is now available. Download your copy today.
For many countries, the world is feeling less and less safe, and governments around the globe are increasing their defence…